The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right- angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane 1. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. This specification covers the performance, test, and quality requirements for the XCede HD Plus backplane interconnect system. AMPHENOL COMMUNICATIONS SOLUTIONS. 40G QSFP+ to QSFP+ DAC Cable. use keep out zone. Choice of 2 or 4 power banks. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Contact Mouser (USA) (800) 346-6873 | Feedback. 0217" Drill XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). RAM Steel Beam Design calculates the number of studs required, accounting for the locations of maximum moments and zero moments and special distributions required due to the presence of point loads. XCede® connectors also address. XCede® connectors also. 384 likes · 6 talking about this · 259 were here. Buy XCede HD Plus Series Backplane Connectors. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. XCede® HD is a small form factor system with a modular design for significant space savings and. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. BENEFITS. 1. Dislaime Please note that the above information is subect to change without notice. FCI. XCede® connectors also address. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。ExaMAX®可实现高达56 Gbps的性能，并使设计师能够选择优化密度或最大程度地减少电路板层数。XCede® HD是一个采用模块化设计的小型系统，可大幅节省空间并提升灵活性。The XCede ® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. View Substitutes & Alternatives along with datasheets, stock, pricing and search for other Backplane Connectors products. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service. 1. Vertical or Right Angle. Available in industry-standard 2. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 2. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card. XCede® RAM. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Price request; Print; Specifications. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Discover More. Video Library > XCede® HD - Samtec’s High-Density Backplane System XCede® HD - Samtec’s High-Density Backplane System XCede® HD features a form factor that is significantly smaller than traditional backplane solutions and has incredible design flexibility for high-density backplane applications. 5-inch backplane 1. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns. Amphenol Communications Solutions XCede high-performance backplane connector system. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. 3A per pin current rating and mount individually to the backplane. 2. Connectors in the dataspace can handle unified message exchanges by returning data model-compliant responses to data requests. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. Contact us today for more details of XCede HD, part number 968-4200-A1H. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. XCede® connectors also address. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. Check Pricing. 4, 6 or 8 columns. Description. Features a simple design, normal or reverse mounting, push-push insert style and a locking technology therefore preventing the card from falling out. XCede® HD 1. 2. Up to 3. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 3. Memory card connector / PCI. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Features & Benefits. Contact Mouser (USA) (800) 346-6873 | Feedback. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. Login or REGISTER Hello, {0}. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test. 1. FEATURES. Up to 3. DETAILS. This connector is a single-row, 40-pin, right-angle male header strip that can be cut or broken into smaller strips and is great for low-profile connections. Article: 00028492. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Part # dimensions for each XCede connector type. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. They are available in 1. drwXCede ® connectors also address requirements for high linear signal density at the backplane and daughter card interface. 00 mm contact wipe on signal pins. 10% coupon applied at checkout Save 10% Details. § Differential pairs 28-84 per inch (11-33 differential pairs per10120130-L0J-20DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Left Wall By apogeeweb, 10120130-l0j-20dlf, 10120130-l0j-20dlf datasheet,10120130-l0j-20dlf pdf,amphenol icc (fci)Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 08mm. Back. Distance Curve of MEP-12T press for XCede and XCede Plus connectors. Standard or high-speed wafers available. Additionally, there will be an electro-static. 96 and 5. Change Location. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating interfaces with XCede ® HD and XCede ® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis. 1. 062") thick cards. 60mm (. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices Explained%PDF-1. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. We offer interconnection systems from 2. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. DC configurations may also be determined by the XHD2 RAM connector to which they will mate for co-planar applications. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. We believe that unlocking the potential of our workforce through outstanding training, earnings potential and reward structures is key to Xcede’s success. Brand of Product：Amphenol ICC,Part#：946-210X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® connectors also address. PDF 957-4100-AXX 4 PAIR POWER. Login or REGISTER Hello, {0}. The XCede HD connector. Other items. XCede® connectors also address. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). Inactivity Warning Dialog. RF Connectors Valcon IPEX Type RF Samtec Bulls Eye® RF Samtec Ganged RF. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. XCede connectors also address requirements for higher linear signal density at the backplane or midplane interface. Search. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 00 mm的触点滑动范围. DC configurations may also be determined by the XHD+ RAM connector to which they will mate for co-planar applications. Amphenol Communications Solutions XCede high-performance backplane connector system. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2. These connectors are two-piece devices that connect two printed circuit boards. XCede ® HD is a small form factor system with a modular design for significant space savings and. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. XCede. Up to 82 differential pairs. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. Complementary guide and power modules are also included in the product range. The. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. This connector ships without wires, terminals and seals. Electrical & Mechanical Models. 0 REFERENCE 2. 1. Login or REGISTER Hello, {0}. 2. XCede® connectors also address. Upload your CV. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. QSFP+ 40G transceiver with MTP/MPO connector; MTP/MPO 12 Fiber Trunk Cable. 4 FMC+ VITA 74 VNX适用于密度关键型应用的小型高密度背板系统，采用模块化设计并提供可选功能，以提升灵活性和实现可定制解决方案。XCede® BACKPLANE CONNECTOR SYSTEM - FCI. 3. Revision SCR No. 三个等级的上电次序实现了热插拔. 三个等级的上电次序实现了热插拔. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. Dislaime Please note that the above information is subject to change without notice. Description. 062") thick cards. Buy HPTS-3-S-D-VT - Samtec - Connector, Xcede HD Series, 4 Contacts, 3. 1. XCede® connectors also address. Receptacle connectors and pin connectors are through-hole devices with eye-of-the-needle compliant pin contacts. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. 1. Three levels of sequencing enable hot plugging. 4, 6 or 8 columns. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connector family. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 2-to-PCIE-x4 adapter cable - but it runs $150. Features. 6. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingBuy XCede HD2 Series Backplane Connectors. XCede ® HD and XCede ® HD Plus, this connector provides . 1. 9 signal pairs per inch are. Amphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. The series offers mechanical longevity and ruggedness, guidance and keying options, and. power connector (J_PWR_B) 7. Offering a linear density of up to 84 differential pairs per inch (33. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. DETAILS. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. - FCI. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Get a Free Sample. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1 DOCUMENTS 2. After the reboot, the 40G port light turns yellow, which means the 40G-10G split configuration is successful. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Basics is present with its full range of products to meet the needs of our customers. 2. Login or REGISTER Hello, {0}. See Appendix “A” for the seating press recommendations and process recommendations. TARGET MARKETS. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal,. Skip to Main Content +49 (0)89 520 462 110. Contact Mouser (USA) (800) 346-6873 | Feedback. challenging architectures. Typical applications include communications and data such as hubs, switches, routers, wireless infrastructure, servers, external storage systems, and more. +44 (0)203 301 9900. For XCede HD RAM and XCede HD Inverted RAM refer to this documents. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contact Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. asm jx410-51594_bp. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . Basically, it is how all major components inside a computer talk with each other. 6. refer to tb-2235 for xcede hd product specifications. $ 129. Please confirm your currency selection:Buy XCede HD Series Backplane Connectors. Choice of 2 or 4 power banks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Features. XCede® BACKPLANE CONNECTOR SYSTEM - FCI. Available with 40, 60 and 80 signal pins. EBCF. Amphenol Communications Solutions. Buy 923400E40H - Amphenol Communications Solutions - Connector, 8 Col x 4 Diff Pair, XCede HD Series, 1. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. - FCI. 6. Brand of Product：Amphenol ICC,Part#：947-4XXX-XXX,Product Category：XCede RAM SIGNAL WAFER,Data. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. Scalable upgrades to 56Gb/s. Here's a hint for each of the word groups in today's Connections puzzle, plus a couple more clues to help you find the answer:. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. Contact us today for more details of XCede HD, part number 970301YD2B. XCede® connectors also address. Product types are available in 3, 4 and 6. 使用Samtec的高速板对板Solutionator®构建您的对接连接器套件 。. The connectors are intermatable, electrically and mechanically interchangeable. 3. This website uses cookies to improve your experience while you navigate through the website. 1. 4 differential signal pairs/inch. 7mil Drill Minimum Pad Size vs. View eCAD Files. These connectors are two-piece devices that connect two printed circuit boards. XCede Daughter Card PWB + Fixture Thickness Requirements and Compliant Pin Protrusion Lengths XCede Connector Type/Size PWB + Fixture Thickness Minimum (mm) 0. 1. For optimal connector configuration, connectors are grouped into signal modules of 4,. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 5 - Effective capacity assumes average 4:1 data reduction. XCEDE® BACKPLANE CONNECTOR SYSTEM XCEDE® POWER SYSTEM 150 grams normal force nominal POWER RATING Modular construction gives an effective current density of 8. No spam. EachAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission and. 2. 1. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Login or REGISTER Hello, {0}. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 0 REFERENCE 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Article: 00229048. Shear Stud Connectors. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 0 REFERENCE 2. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. Find Parts. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Wang 2/18/16 C S7764 Updated document title, Added XCede HD2 backplane information B. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. Complementary guide and power modules are also included in the product range. 0 TOOLING 1. XCede 85 Ohm for applications where matching lower system impedance is desired and XCede cable. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. backplane to expander board connector (BP_XCEDE_2) 3. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 00 mm的触点滑动范围. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede HD achieves the highest performance in an HM compatible form factor. These point loads may be caused by other beams, user input loads, or columns carried by the beam. The series offers mechanical. XCede ® HD2 §XCede ® and AirMax are excellent and proven board-to-board connectors for backplane, mezzanine, orthogonal, or coplanar solutions up to 25Gb/s. 3. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Let’s take a look at a typical higher level motherboard for an example of connector and port types. 3-, 4- and 6-pair designs. 信号端子上可实现高达3. 1. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall XCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. See Figure 15 for details. Lukin 10/01/13 “C” “D”. 3. 1. Customer Measurement Report: FCI XCede® Connector. 60mm Gen-Z connectors conform to SFF-TA-1002, OCP NIC 3. 9 signal pairs/inch and can be used down to 25 mm card slot pitch. XCede® HD 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 4. The XCede ® I/O connector supports next generation 100G+ applications and. BENEFITS. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. 4. 0177" drill, nano ni, std gold 1. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. Revision “F” Specification Revision Status . 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. 1. 1. The inserts can be installed as per the. Amphenol Xcede Series High Speed/Modular Connectors are available at Mouser Electronics. XCede® Family Cable Assemblies MATERIAL §§Contacts: High. 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design provides flexibility in applications The XCede HD interconnect platform also has available RAM (Right Angle Male). Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 1. 3. 2. 2. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. Change Location. Aug 25, 2011XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. 1. DETAILS. 2. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine,. We would like to show you a description here but the site won’t allow us. These connectors are available in 3-, 4- and 6-Pair configurations. 2. 信号端子上可实现高达3. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. A full range of flash memory connectors are offered by Amphenol, including SD, Mini-SD, Micro-SD, xD, CF1 & 2. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 1. Connector & Configuration Pair Size Product type Columns XCede HD Backplane 3 4 6 8 12 14 24 15 22 30 40 44 Vertical Header Signal Vertical Header Signal Vertical Header Signal Standard Enhanced Enh Gen 2 Vertical Receptacle Power R/A Header Power R/A Receptacle Guide ModuleXCede High Speed / Modular Connectors are available at Mouser Electronics. Features. 2 The daughtercard connector building blocks include signal modules, power modules,. Integrated power and guidance. For a 4-pair differential connector per column, 54. 6 %âãÏÓ 2647 0 obj > endobj 2677 0 obj >/Encrypt 2648 0 R/Filter/FlateDecode/ID[65646E18716E2B4991C9C621A98364C7>]/Index[2647 447]/Info 2646 0 R/Length 155. XCede HD PLUS & XCede HD2 daughtercard single wafer replacement. 2. High-density backplane system – up to 84 differential pairs per linear inch. ExaMAX® 2. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . Jump to a Section. Contact us today for more details of XCede, part number 922-440G-F3H Toggle Nav. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. 10119128-B0C-40DLF Datasheets | Backplane Connectors - Specialized Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Left By apogeeweb, 10119128-b0c-40dlf, 10119128-b0c-40dlf datasheet,10119128. Samtec XCede® HD HPTS 3. Guidance and keying options. XCede® connectors also address requirements for high linear signal density at the backplane and daughter card interface. 2. Integrated power and guidance. XCede® connectors also address. Mouser offers inventory, pricing, & datasheets for XCede Connectors. 2. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 4, 6 or 8 columns. Board-to-board connector / rectangular / SMT. 2. performance (up to 28+ Gb/s) in a Hard Metric form factor. Login or REGISTER Hello, {0}. Xcede's first Data Networking Event in Manchester was a great success, and we can't thank the incredible team at Moneysupermarket enough for co-hosting with us at their fantastic Manchester office. screw length and part number are dependent on daughtercard thickness (as specified from configurator). 4. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Description Initial Date “A” S2401 Initial Release E. Page 174 Figure 127. Spacone 5-29-12 The XCede® Right-Angle Male (XCede® RAM) connector allows designers to grow their systems horizontally or add a new cabling solution by creating traditional. Amphenol is one of the leading manufacturers of Backplane connectors. During this. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Vertical or Right Angle. . Send us a Message. Backwards mate compatibility. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. Features. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. DC Connector Configurations. performance (up to 28+ Gb/s) in a Hard Metric form factor. DETAILS. 5 - Effective capacity assumes average 4:1 data reduction. XCede High Speed / Modular Connectors are available at Mouser Electronics. Accepts 1. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed/Modular Connectors. XCede® connectors also address. 20mm Power Modules.